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1
Solder Joint Technology: Materials, Properties, and Reliability (Springer Series in Materials Science)
Springer
King-Ning Tu
solder
electromigration
chip
eutectic
growth
current
reaction
temperature
sn5
cu6
svny339
stress
imc
joint
snpb
surface
joints
μm
formation
diffusion
bump
density
whisker
wetting
layer
april
shown
flip
grain
molten
scallops
flux
cm2
solid
ubm
effect
reactions
cathode
cu3
interfacial
gradient
thermomigration
volume
void
substrate
anode
electron
rate
figure
film
年:
2007
语言:
english
文件:
PDF, 10.80 MB
您的标签:
0
/
0
english, 2007
2
Solder Joint Technology
Springer
King-Ning Tu
solder
chip
electromigration
growth
eutectic
current
reaction
temperature
cu6sn5
stress
svny339
imc
joint
snpb
surface
joints
flip
formation
μm
diffusion
bump
whisker
density
layer
wetting
shown
april
flux
grain
molten
scallops
solid
cu3sn
effect
ubm
reactions
cathode
gradient
interfacial
cm2
volume
void
thermomigration
anode
substrate
figure
rate
electron
technology
atomic
年:
2010
语言:
english
文件:
RAR, 10.59 MB
您的标签:
0
/
0
english, 2010
3
Solder joint technology
Springer
King-ning Tu
solder
electromigration
chip
eutectic
growth
current
reaction
temperature
sn5
cu6
svny339
stress
imc
joint
snpb
surface
joints
μm
formation
diffusion
bump
density
whisker
wetting
layer
shown
april
flip
grain
molten
scallops
flux
cm2
solid
ubm
effect
reactions
cathode
cu3
interfacial
gradient
thermomigration
volume
void
substrate
anode
electron
rate
figure
film
年:
2007
语言:
english
文件:
PDF, 10.99 MB
您的标签:
0
/
0
english, 2007
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